Links

Links

As clients permit, we will post links to present the results of some of our activities

Some of the links in this section will take you to Web sites not owned or operated by Clayton & associates. Clayton & associates is not responsible for the condition of these links or the information they provide.  If you would like to report an issue with one of these links or the information displayed please contact us at info@clayton-assoc.com and we will investigate the issue.



Annidis NSBRI

Joint Annidis & NSBRI paper on the relevance of Multi-Spectral Imaging (MSI) to space medicine
A novel space ocular syndrome ...  SPIE Defense + Security Conference, San Diego, May 2017
Proc. SPIE 10194, Micro- and Nanotechnology Sensors, Systems, and Applications IX, (18 May 2017)



MIT CTR-II

The linked documents refer to phase II of the Communications Technology Roadmap: CTR-II. In particular our chapter: Integration, Packaging & Interconnect (complete chapter not available on-line)
Communications Technology Roadmap: CTR-II
Photonic packaging and interconnection for high capacity meter scale systems
MIT Microphotonics Center 2009 Spring Meeting
2010 CTR Roadshow



Utrecht_XiO

The linked document is the presentation portion of an interactive presentation discussing the challenges of opto-electronic and photonic packaging.
Photonic Packaging Workshop Presentation Utrecht, NL, October 2009



CS-MAX02

III-V optoelectronic integration issues and the MIT Communications Technology Roadmap (CTR)
CS-MAX 2005:
Palm Springs, USA, October 2005
CS-MAX2005



ePIXnet_mtglogo02

Microphotonics: Hardware for the information Age
ePIXnet Annual Meeting:
Eindhoven, NL, September 2005
ePIXnet 2005



ctr_logo02 We have been an active supporter of the MIT Microphotonics Centerís Communications Technology Roadmap project, as technical contributor, chapter co-author and member of the editorial advisory board for Phase I (completed May 2005) and for the initiation of Phase II (November 2005)

For more information, please see:
mph-roadmap.mit.edu or Integration in III-V Materials
This activity has resulted in invited presentations on the topic at international meetings



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